Industry Press
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
SEMI
Herman Itzkowiitz joins MCL as Chief Technology Officer
MicroCircuit Laboratories LLC
AP&S Establishes Site in the USA
AP&S
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
QP Technologies
Exploring the impact of Generative AI: identifying the winners
YOLE Group
IMAPS & IPC to Host Onshoring Workshop April 29 – May 1, 2024
IMAPS
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
SEMI
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023, SEMI Reports
SEMI
MORE INDUSTRY PRESS
What Year Was It?
The day was Apr 17. What year was it?
Apollo 13 Returns to Earth
What Year
With the world anxiously watching, Apollo 13, a U.S. lunar spacecraft that suffered a severe malfunction on its journey to the moon, safely returns to Earth.
See the answer below.
What Year Was It Answer
Apollo 13 Returns to Earth
Answer: April 17, 1970
April 18, 2024
Why it’s so hard for China’s chip industry to become self-sufficient
A surprising link emerges between MSG and computer chips: Ajinomoto, known for MSG, monopolizes ABF, a crucial chip component. Thintronics and Chinese firms vie to disrupt this. US and Japan deepen tech alliance, while China rushes for self-sufficiency amidst chip tensions.
MIT Technology Review
TSMC No.1 and Nvidia posts triple-digit growth in TechInsights 2023 top-25 chip suppliers rankings
TechInsights' 2023 ranking of top 25 semiconductor suppliers revealed no newcomers, yet saw notable shifts in rankings based on sales revenues, highlighting dynamic industry changes as established players jostle for position in a competitive market landscape.
Digitimes
Decapsulation of Multi-Tier Wire-Bonded Semiconductors
Decapsulation of packaged integrated circuits is routinely conducted in FA and reliability tests. In this work, we decapsulate a complex packaged semiconductor device with multi-tier palladium-coated copper bond wires.
Technical Paper
Future-Proofing Automotive V2X
Semiconductor experts discuss Vehicle-To-Everything (V2X) technology's deployment path. Shawn Carpenter highlights safety benefits for all drivers. Ron DiGiuseppe emphasizes V2X's real-time safety applications, urging exploration of the 5G standard. Collaboration with regulatory bodies is crucial, stresses Daniel Dalpiaz.
Semiconductor Engineering
Apple Exploring The Use Of TSMC’s Small Outline Integrated Circuit Packaging For Future Chip Releases Due To Lowered Power Consumption, Other Perks
Apple's partnership with TSMC for cutting-edge chips explores new horizons with rumored SoIC packaging. Yeux1122 hints at increased CoWoS capacity and SoIC's potential benefits. SoIC promises higher densities, lower power consumption, and smaller footprints, potentially revolutionizing Apple's product lineup by 2025 or 2026.
Wccftech
Intel to launch low end AI chips in China to comply with US export rules
In June and September, Intel plans to launch HL-382 and HL-388 chips for China, adapting its Gaudi 3 line to meet export regulations. The US strengthens semiconductor production with trade controls and the CHIPS Act, awarding Intel $8.5bn for fabs and research. GlobalData predicts an 'AI chip race' in 2024, with the AI market expected to reach $909bn by 2030, led by a surge in GenAI revenue to $33bn by 2027.
Verdict
China's Semiconductor Output jumps 40% in Q1 Amid Growing Dominance in Legacy Chips
China's integrated circuit (IC) output skyrockets by 40%, hitting 98.1 billion units in Q1, driven by expansion in older chip production amid US trade restrictions. National output soars 28.4% in March alone, reaching a record high, signaling rapid growth in hi-tech manufacturing.
South China Morning Post
Samsung enters high-stakes chip race with TSMC, Intel on back of US subsidy
Samsung Electronics intensifies competition in the booming AI chip market, securing a $6.4 billion U.S. subsidy. Plans include a new semiconductor factory in Texas, reinforcing local production and challenging rivals TSMC and Intel. This move aims to solidify Samsung's foothold.
The Korea Times
Intel urges collaboration between partners from Taiwan and India
At the Taiwan and India Ecosystem Partners Connection event on April 12, Grace Wang, Intel Taiwan's VP, urged partners to strengthen ties. Intel's VP emphasized collaboration, fostering deeper relationships between Taiwanese and Indian partners for mutual growth.
Digitimes
Sustainability 101: Refuse, Reduce, Repair, Refurbish, Rework
Discovering sustainable practices in electronics: a guide to refuse, reduce, repair, refurbish, and rework. Exploring how embracing these principles can mitigate environmental impact and foster a circular economy in the tech industry.
3DInCites
Intel to launch low end AI chips in China to comply with US export rules
Intel is set to unveil low-end AI chips in China to navigate stringent US export regulations. This strategic move aims to maintain its global presence amid escalating tensions, ensuring compliance while catering to the burgeoning Chinese market's demands for AI technology.
Verdict
What's going on with the chiplet market?
The chiplet market is booming as semiconductor giants vie for dominance. With innovative designs and collaborations, companies are breaking boundaries, driving competition, and shaping the future of computing technology.
PC World
AMD rolls out its latest chips for AI PCs as competition with Nvidia and Intel heats up
AMD intensifies competition with Nvidia and Intel by launching new chips tailored for AI and PCs. The move comes amidst a fierce battle for dominance in the semiconductor market, signaling AMD's commitment to innovation and technological advancement.
CNBC
Will MicroLEDs Revolutionize Our Screens?
MicroLEDs, touted as the next big thing in display technology, promise superior brightness, energy efficiency, and durability. With potential applications ranging from smartphones to massive digital billboards, they could reshape the future of visual experiences.
EE Times
Microsoft invests $1.5 billion in AI firm G42 which faces U.S. scrutiny for China ties
Microsoft, aiming to fortify its tech prowess, invests $1.5 billion in UAE-based AI firm G42, with President Brad Smith joining its board. The minority stake deal, backed by US-UAE governments, ensures secure AI development on Azure.
CNBC
Secure Movement Of Data In Test
New techniques ensure secure data transfer during semiconductor testing, safeguarding against cyber threats. By integrating encryption and authentication into test systems, vulnerabilities are minimized, boosting trust in critical data handling processes.
Semiconductor Engineering
Research Bits: April 16
Researchers at CiQUS and Forschungszentrum Juelich uncovered that oxide-based memristive devices exhibit adjustable thermal conductivity alongside electrical resistive switching. Oxygen ion accumulation at the metal-oxide interface induces a 20% modulation in heat flow resistance.
Semiconductor Engineering
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Test Your Knowledge
What do you call the maximum time period that an adhesive can be exposed to ambient conditions with its chemical and physical properties remaining within satisfactory limits?
See answer below.
Quote of the Day
If an idea's worth having once, it's worth having twice.
Tom Stoppard
Industry Calendar
Apr 19, 2024
Silicon substrate preparation, identifying & preventing defects of of the substrate
SEMI
Apr 22, 2024
Plasma Etching, ALE, and RIE
SEMI
Apr 29, 2024
Onshoring 2024
IMAPS & IPC
Apr 30, 2024
ABCs of Basic Electronics and Devices
SEMI
Apr 30, 2024
The 27th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition
TJ Green Associates, LLC
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Cartoon
"When opportunity knocked, I didn't recognize it. It was disguised as hard work."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What do you call the maximum time period that an adhesive can be exposed to ambient conditions with its chemical and physical properties remaining within satisfactory limits?
Answer: Working Time or Pot Life